Lqfp 144

Lqfp 144 DEFAULT

Quad flat package

Surface mount integrated circuit package with "gull wing" pins extinding from all sides

"QFP" redirects here. For the digital logic technology, see Quantum flux parametron.

A quad flat package (QFP) is a surface-mountedintegrated circuitpackage with "gull wing" leads extending from each of the four sides.[1] Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Other special variants include low-profile QFP (LQFP) and thin QFP (TQFP).[2]

The QFP component package type became common in Europe and United States during the early nineties, even though it has been used in Japaneseconsumer electronics since the seventies. It is often mixed with hole mounted, and sometimes socketed, components on the same printed circuit board (PCB).

A package related to QFP is plastic leaded chip carrier (PLCC) which is similar but has pins with larger pitch, 1.27 mm (or 1/20 inch), curved up underneath a thicker body to simplify socketing (soldering is also possible). It is commonly used for NOR flash memories and other programmable components.

Limitations[edit]

The quad flat-pack has connections only around the periphery of the package. To increase the number of pins, the spacing was decreased from 50 mil (as found on small outline packages) to 20 and later 12 (1.27 mm, 0.51 mm and 0.30 mm respectively). However, this close lead spacing made solder bridges more likely and put higher demands on the soldering process and alignment of parts during assembly.[1] The later pin grid array (PGA) and ball grid array (BGA) packages, by allowing connections to be made over the area of the package and not just around the edges, allowed for higher pin counts with similar package sizes, and reduced the problems with close lead spacing.

Variants[edit]

  • 144-pin low profile quad flat package (LQFP)

  • 80-pin thin quad flat package (TQFP)

  • 304-pin plastic quad flat package (QFP) with exposed thermal pad (TP)

The basic form is a flat rectangular (often square) body with leads on four sides but with numerous variation in the design. These differ usually only in lead number, pitch, dimensions, and materials used (usually to improve thermal characteristics). A clear variation is bumpered quad flat package (BQFP) with extensions at the four corners to protect the leads against mechanical damage before the unit is soldered.

Heat sink quad flat package, heatsink very thin quad flat-pack no-leads (HVQFN) is a package with no component leads extending from the IC. Pads are spaced along the sides of the IC with an exposed die that can be used as ground. Spacing between pins can vary.

A thin quad flat pack (TQFP) provides the same benefits as the metric QFP, but is thinner. Regular QFP are 2.0 to 3.8 mm thick depending on size. TQFP packages range from 32 pins with a 0.8 mm lead pitch, in a package 5 mm by 5 mm by 1 mm thick, to 256 pins, 28 mm square, 1.4 mm thick and a lead pitch of 0.4 mm.[2]

TQFPs help solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 176. Body sizes range from 5 mm x 5 mm to 20  x 20 mm. Copper lead-frames are used in TQFPs. Lead pitches available for TQFPs are 0.4 mm, 0.5 mm, 0.65 mm, 0.8 mm, and 1.0 mm. PQFP, or plastic quad flat pack, is a type of QFP, as is the thinner TQFP package. PQFP packages can vary in thickness from 2.0 mm to 3.8 mm. A low-profile quad flat package (LQFP) is a surface mountintegrated circuit package format with component leads extending from each of the four sides. Pins are numbered counter-clockwise from the index dot. Spacing between pins can vary; common spacings are 0.4, 0.5, 0.65 and 0.80 mm intervals.

Package
BQFP: bumpered quad flat package
BQFPH: bumpered quad flat package with heat spreader
CQFP: ceramic quad flat package
EQFP: plastic enhanced quad flat package
FQFP: fine pitch quad flat package
LQFP: low profile quad flat package
MQFP: metric quad flat package
NQFP: near chip-scale quad flat package.[3]
SQFP: small quad flat package
TQFP: thin quad flat package
VQFP: very small quad flat package
VTQFP: very thin quad flat package
TDFN: thin dual flat no-lead package.[4]

Some QFP packages have an exposed pad. The exposed pad is an extra pad underneath or on top of the QFP that may act as a ground connection and/or as a heat sink for the package. The pad is typically 10 or more mm², and with the pad soldered down onto the ground plane, heat is passed into the PCB. This exposed pad also gives a solid ground connection. These type of QFP packages often have a -EP suffix (e.g. a LQFP-EP 64), or they have an odd number of leads, (e.g. a TQFP-101).

Ceramic QFP package[edit]

Ceramic QFP packages come in two variants, CERQUAD and CQFP:

CERQUAD packages:

Hereby the leadframe is attached between two ceramic layers of the package. The leadframe is attached using glass. This package is a variant of the CERDIP package. CERQUAD packages are the "low cost" alternative for CQFP packages, and are mainly used for terrestrial applications. Main ceramic package manufacturers are Kyocera, NTK,... and offer the full pincount range

CQFP packages:

Hereby the leads are soldered on top of the package. The package is a multilayer package, and is offered as HTCC (High Temperature co-fired ceramic). The number of bonding decks can be one, two or three. Package is finished with a nickel plus a thick gold layer, except where the leads are soldered and decoupling capacitors are soldered on top of the package. These packages are hermetic. Two methods are used in order to make the hermetic sealing: eutectic gold-tin alloy (melting point 280C) or seam welding. Seam welding gives rise to significantly less temperature rise in the internal of the package (e.g. the die attach). This package is the main package used for Space projects. Due to the large body size of CQFP packages, parasitics are important for this package. Power supply decoupling is improved by having the decoupling capacitors mounted on top of this package. e.g. TI offers 256-pin CQFP packages where decoupling capacitors can be soldered on top of the package[5] e.g. Test-expert 256-pin CQFP packages where decoupling capacitors can be soldered on top of the package.[6] The main ceramic package manufacturers are Kyocera (Japan), NTK (Japan), Test-Expert (Russia), etc. and offer the full pincount range. Maximum pin count is 352 pins.

See also[edit]

References[edit]

External links[edit]

Sours: https://en.wikipedia.org/wiki/Quad_flat_package

SOT486-2: LQFP144

Overview

LQFP144, plastic, low profile quad flat package; 144 terminals; 0.5 mm pitch; 20 mm x 20 mm x 1.4 mm body

Package VersionPackage NameMountTerminal PositionPackage StyleDimensionsTermination CountMaterial
 SOT486-2LQFP144surface mountquadLQFP20 x 20 x 1.4144plastic
Manufacture CodeReference CodesIssue Date
98ASS23177WFL-PQFP-G144(JEDEC)2017-06-11

Products

PartDescriptionQuick access
MC68332ACAG1632BIT MCU,2KRAM,TPU,QSM View parametrics
S912XET512BCAG16-bit MCU, S12X core, 512KB Flash, 50MHz, -40/+85degC, Automotive Qualified, QFP 144 View parametrics
SPC5744PFK1AMLQ92 x e200Z4 cores in LS, 200 MHz, 2.5MB Flash, 384kB SRAM, LQFP 144, 1 x FlexRay, –40°C to +125°C View parametrics
MK21FN1M0VLQ12Kinetis K21: 120MHz Cortex-M4F MCU, 1MB Flash, 128KB SRAM, Full-Speed USB, Anti-tamper, 144-LQFP View parametrics
S912XET256BMAG16-bit MCU, S12X core, 256KB Flash, 50MHz, -40/+125degC, Automotive Qualified, QFP 144 View parametrics
MCF5249LCAG120MCF5249 V2CORE 96KSRAM View parametrics
DSP56303AG10024-BIT DSP PB-FREE View parametrics
S912XEQ512J3VAG16-bit MCU, S12X core, 512KB Flash, 50MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
S912XEQ384F1MAG16-bit MCU, S12X core, 384KB Flash, 50MHz, -40/+125degC, Automotive Qualified, QFP 144 View parametrics
MC9S12XDP512CAGS12XD 16-bit MCU, HCS12X core, 512KB Flash, 80MHz, QFP 144 View parametrics
FS32K146UAT0VLQTS32K146 Arm Cortex-M4F, 112 MHz, 1 Mb Flash, CAN FD, FlexIO, CSEc security, LQFP144 - S32K MCUs for General Purpose View parametrics
SPC5741PK1AMLQ52 x e200Z4 cores in LS, 150 MHz, 1.0MB Flash, 128kB SRAM, LQFP 144, –40°C to +125°C View parametrics
S912XEP100BVAG16-bit MCU, S12X core, 1MB Flash, 50MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
MC56F8366MFVE16-bit DSC, 56800E core, 512KB Flash, 60MHz, QFP 144 View parametrics
MC9S12XEQ384MAG16-bit MCU, S12X core, 384KB Flash, 50MHz, -40/+125degC, QFP 144 View parametrics
MK50DN512CLQ10Kinetis K50: 100MHz Cortex-M4 Performance MCU, 512KB Flash, 128KB SRAM, Full-Speed USB, 144-LQFP View parametrics
FS32K146HAT0MLQTS32K146 Arm Cortex-M4F, 80 MHz, 1 Mb Flash, CAN FD, FlexIO, CSEc security, LQFP144 - S32K MCUs for General Purpose View parametrics
MC9S12XDT256CAGS12XD 16-bit MCU, HCS12X core, 256KB Flash, 80MHz, QFP 144 View parametrics
S912XEP768J2VAG16-bit MCU, S12X core, 768KB Flash, 50MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
SPC5607BK0MLQ6NXP 32-bit MCU, Power Arch core, 1.5MB Flash, 64MHz, -40/+125degC, Automotive Grade, QFP 144 View parametrics
SPC5602BF2CLQ4NXP 32-bit MCU, Power Arch core, 256KB Flash, 48MHz, -40/+85degC, Automotive Grade, QFP 144 View parametrics
SPC5604PGF1MLQ6NXP 32-bit MCU, Power Arch core, 512KB Flash, 64MHz, -40/+125degC, Automotive Grade, QFP 144 View parametrics
MK10FX512VLQ12Kinetis K10: 120MHz Cortex-M4F Performance MCU, 512KB Flash + 512KB FlexMem, 128KB SRAM, 144-LQFP View parametrics
MK40DN512VLQ10Kinetis K40: 100MHz Cortex-M4 MCU, 512KB Flash, 128KB SRAM, Full-Speed USB, Segment LCD, 144-LQFP View parametrics
S912XET256J2MAG16-bit MCU, S12X core, 256KB Flash, 50MHz, -40/+125degC, Automotive Qualified, QFP 144 View parametrics
S912XDP512J1VAG16-bit MCU, S12X core, 512KB Flash, 80MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
S912XDP512F0MAG16 BIT 512K FLASH View parametrics
SPC5514EAMLQ66NXP 32-bit MCU, Power Arch core, 512KB Flash, 66MHz, -40/+125degC, Automotive Grade, QFP 144 View parametrics
MK53DN512ZCLQ10Kinetis K53: 100MHz Cortex-M4 Measurement MCU, 512KB Flash, 128K RAM, USB, ETH, Segment LCD, 144LQFP View parametrics
SPC5633MF2MLQ80NXP 32-bit MCU, Power Arch core, 1MB Flash, 80MHz, -40/+125degC, Automotive Grade, QFP 144 View parametrics
SPC5603BK0CLQNXP 32-bit MCU, Power Arch core, 384KB Flash, -40/+85degC, Automotive Grade, QFP 144 View parametrics
S912XEQ512J2CAG16-bit MCU, S12X core, 512KB Flash, 50MHz, -40/+85degC, Automotive Qualified, QFP 144 View parametrics
MCF52259CAG80MCF522XX 32-bit MCU, ColdFire V2 core, 512KB Flash, 80MHz, QFP 144 View parametrics
SPC5515SBVLQ48NXP 32-bit MCU, Power Arch core, 768KB Flash, 48MHz, -40/+125degC, Automotive Grade, QFP 144 View parametrics
S912XET512J2VAG16-bit MCU, S12X core, 512KB Flash, 50MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
DSPB56362AG120LEAD FREE DSP56362 View parametrics
SPC5744PK1AMLQ52 x e200Z4 cores in LS, 150 MHz, 2.5MB Flash, 384kB SRAM, LQFP 144, –40°C to +125° View parametrics
SPC5606BF1MLQ6NXP 32-bit MCU, Power Arch core, 1MB Flash, 64MHz, -40/+125degC, Automotive Grade, QFP 144 View parametrics
SPC5634MF1MLQ801.5M Flash,94K RAM,e200z335 View parametrics
S912ZVHL32F1CLQMagniV 16-bit MCU, S12Z core, 32KB Flash, 32MHz, -40/+85degC, Automotive Qualified, QFP 144 View parametrics
FS32K148UIT0VLQTS32K148 Arm Cortex-M4F, 112 MHz, 2 Mb Flash, ISELED, FlexIO, LQFP144 - S32K MCUs for General Purpose View parametrics
SPC5604BAVLQ6NXP 32-bit MCU, Power Arch core, 512KB Flash, 64MHz, -40/+105degC, Automotive Grade, QFP 144 View parametrics
MC56F8156VFVE16-bit DSC, 56800E core, 256KB Flash, 40MHz, QFP 144 View parametrics
S9S12H256J2CFVE16-bit MCU, S12 core, 256KB Flash, 50MHz, -40/+85degC, Automotive Qualified, QFP 144 View parametrics
MK10DX256VLQ10Kinetis K10: 100MHz Cortex-M4 Performance MCU, 512KB Flash, 64KB SRAM, 144-LQFP View parametrics
SPC5604BAVLQ4NXP 32-bit MCU, Power Arch core, 512KB Flash, 48MHz, -40/+105degC, Automotive Grade, QFP 144 View parametrics
MK64FN1M0VLQ12Kinetis K64: 120MHz Cortex-M4F MCU, 1MB Flash, 256KB SRAM, Full-Speed USB, Ethernet, 144-LQFP View parametrics
SPC5602SF1VLQ632 BIT 256K FLASH 24K RAM View parametrics
MK10FN1M0VLQ12Kinetis K10: 120MHz Cortex-M4F Performance MCU, 1MB Flash, 128KB SRAM, 144-LQFP View parametrics
MC68340CAG16E32BIT MPU,DMA,TIMER View parametrics
MC68EN302CAG20BT68K INTGR COM PROC ETHRN View parametrics
MC56F8356VFVE16-bit DSC, 56800E core, 256KB Flash, 60MHz, QFP 144 View parametrics
MC56F8366VFVE16-bit DSC, 56800E core, 512KB Flash, 60MHz, QFP 144 View parametrics
S912ZVHY32F1VLQMagniV 16-bit MCU, S12Z core, 32KB Flash, 32MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
MK60DX256VLQ10Kinetis K60: 100MHz Cortex-M4 MCU, 512KB Flash, 64KB SRAM, Full-Speed USB, Ethernet, 144-LQFP View parametrics
MK64FX512VLQ12Kinetis K64: 120MHz Cortex-M4F MCU, 512KB Flash + 128KB FlexMem, 256KB RAM, USB, Ethernet, 144LQFP View parametrics
MC9S12XHZ512CAG16-bit MCU, S12X core, 512KB Flash, 80MHz, -40/+85degC, QFP 144 View parametrics
SPC5607BK0VLQ6NXP 32-bit MCU, Power Arch core, 1.5MB Flash, 64MHz, -40/+105degC, Automotive Grade, QFP 144 View parametrics
GPC5604BF2MLQ6NXP 32-bit MCU, Power Arch core, 512KB Flash, 64MHz, -40/+125degC, Automotive Grade, QFP 144 View parametrics
S912XEQ384J3VAG16-bit MCU, S12X core, 384KB Flash, 50MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
SPC5517EBCLQ66NXP 32-bit MCU, Power Arch core, 1.5MB Flash, 66MHz, -40/+85degC, Automotive Grade, QFP 144 View parametrics
MK10DN512ZVLQ10Kinetis K10: 100MHz Cortex-M4 Performance MCU, 512KB Flash, 128KB SRAM, 144-LQFP View parametrics
MK30DN512ZVLQ10Kinetis K30: 100MHz Cortex-M4 Performance MCU, 512KB Flash, 128KB SRAM, Segment LCD, 144-LQFP View parametrics
MC9S12H256VFVE16-bit MCU, S12 core, 256KB Flash, 50MHz, -40/+105degC, QFP 144 View parametrics
S912XEP76W0AMAG16-bit MCU, S12X core, 768KB Flash, 50MHz, -40/+125degC, Automotive Qualified, QFP 144 View parametrics
S912XDT384J0CAG16-bit MCU, S12X core, 384KB Flash, 80MHz, -40/+85degC, Automotive Qualified, QFP 144 View parametrics
SPC5634MF1MLQ60NXP 32-bit MCU, Power Arch core, 1.5MB Flash, 60MHz, -40/+125degC, Automotive Grade, QFP 144 View parametrics
MKM35Z512VLQ7KM35: 75MHz Cortex-M0+ Metrology MCU, 512KB Flash, 64KB SRAM, Segment LCD, 144-LQFP View parametrics
S912ZVH128F2VLQMagniV 16-bit MCU, S12Z core, 128KB Flash, 32MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
DSP56F805FV80E16-bit DSC, 56800 core, 64KB Flash, 80MHz, QFP 144 View parametrics
SPC5606BK0CLQ6NXP 32-bit MCU, Power Arch core, 1MB Flash, 64MHz, -40/+85degC, Automotive Grade, QFP 144 View parametrics
SPC5606BK0CLQ4NXP 32-bit MCU, Power Arch core, 1MB Flash, 48MHz, -40/+85degC, Automotive Grade, QFP 144 View parametrics
S912XEG384AVAG16-bit MCU, S12X core, 384KB Flash, 50MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
MAC7116VAG5032-bit MCU, ARM7TDMI-S, 32KB Flash, 50MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
S912ZVFP64F1CLQMagniV 16-bit MCU, S12Z core, 64KB Flash, 32MHz, -40/+85degC, Automotive Qualified, QFP 144 View parametrics
S912XET512J3VAG16BIT,512K FLASH 144LQFP View parametrics
S912XDT256F1CAG16-bit MCU, S12X core, 256KB Flash, 80MHz, -40/+85degC, Automotive Qualified, QFP 144 View parametrics
S912ZVHL32F1VLQMagniV 16-bit MCU, S12Z core, 32KB Flash, 32MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
SPC5632MF2MLQ60768K Flash,48K RAM,e200z335 View parametrics
S912XEP100AVAG16-bit MCU, S12X core, 1MB Flash, 50MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
MC68332ACAG2532BIT MCU,2KRAM,TPU,QSM View parametrics
MKV56F512VLQ24Kinetis KV56: 220MHz Cortex-M7F Real-Time Control MCU, 512KB Flash, 128KB SRAM, 144-LQFP View parametrics
S912XEP100J5MAG16-bit MCU, S12X core, 1MB Flash, 50MHz, -40/+125degC, Automotive Qualified, QFP 144 View parametrics
MC68332ACAG2032BIT MCU,2KRAM,TPU,QSM View parametrics
MK50DX256ZCLQ10Kinetis K50: 100MHz Cortex-M4 Performance MCU, 512KB Flash, 64KB SRAM, Full-Speed USB, 144-LQFP View parametrics
MK52DN512CLQ10Kinetis K52: 100MHz Cortex-M4 Measurement MCU, 512KB Flash, 128KB SRAM, USB, Ethernet, 144-LQFP View parametrics
SPC5517GAMLQ66NXP 32-bit MCU, Power Arch core, 1.5MB Flash, 66MHz, -40/+125degC, Automotive Grade, QFP 144 View parametrics
SPC5603BF2VLQ4NXP 32-bit MCU, Power Arch core, 384KB Flash, 64MHz, 48MHz, -40/+105degC, Automotive Grade, QFP 144 View parametrics
MC68LK332ACAG1632BIT MCU,2KRAM,TPU,QSM View parametrics
MC9S12XET256CAG16-bit MCU, S12X core, 256KB Flash, 50MHz, -40/+85degC, QFP 144 View parametrics
S912XDG512J1CAG16-bit MCU, S12X core, 512KB Flash, 80MHz, -40/+85degC, Automotive Qualified, QFP 144 View parametrics
SPC5602BF2MLQ4NXP 32-bit MCU, Power Arch core, 256KB Flash, 48MHz, -40/+125degC, Automotive Grade, QFP 144 View parametrics
SPC5514GBMLQ66Freescale 32-bit MCU, Power Arch core, 512KB Flash, 66MHz, -40/+125degC, Automotive Grade, QFP 144 View parametrics
MKM34Z256VLQ7Kinetis KM34: 75MHz Cortex-M0+ Metrology MCU, 256KB Flash, 32KB SRAM, Segment LCD, 144-LQFP View parametrics
SPC5604PGF1VLQ6NXP 32-bit MCU, Power Arch core, 512KB Flash, 64MHz, -40/+105degC, Automotive Grade, QFP 144 View parametrics
S912XHZ384F1VAG16-bit MCU, S12X core, 384KB Flash, 80MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
S9S12H128J1VFVE16-bit MCU, S12 core, 128KB Flash, 50MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
S912XET512AVAG16-bit MCU, S12X core, 512KB Flash, 50MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
MC68CK16Z1CAG1616BIT,1KRAM,32KHZCRYSTAL View parametrics
SCF5249LAG133PB-FREE AMADEUS 133MHZ View parametrics
MK66FN2M0VLQ18Kinetis K66: 180MHz Cortex-M4F MCU, 2MB Flash, 256KB SRAM, Dual USBs (FS + HS), Ethernet, 144-LQFP View parametrics
E912XEP768W0MAG16-bit MCU, S12X core, 768KB Flash, 50MHz, -40/+125degC, Automotive Qualified, QFP 144 View parametrics
S912XEG384J3VAG16-bit MCU, S12X core, 384KB Flash, 50MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
MC68332GVAG1632BIT MCU,2KRAM,TPU,QSM View parametrics
SPC5515SBMLQ66NXP 32-bit MCU, Power Arch core, 768KB Flash, 66MHz, -40/+125degC, Automotive Grade, QFP 144 View parametrics
SPC5743PFK1AMLQ92 x e200Z4 cores in LS, 200 MHz, 2.0MB Flash, 256kB SRAM, LQFP 144, 1 x FlexRay, –40°C to +125°C View parametrics
SPC5604BF2VLQ4NXP 32-bit MCU, Power Arch core, 512KB Flash, 48MHz, -40/+105degC, Automotive Grade, QFP 144 View parametrics
SPC5604BF2VLQ6NXP 32-bit MCU, Power Arch core, 512KB Flash, 64MHz, -40/+105degC, Automotive Grade, QFP 144 View parametrics
SPC5514EBMLQ66NXP 32-bit MCU, Power Arch core, 512KB Flash, 66MHz, -40/+125degC, Automotive Grade, QFP 144 View parametrics
MMC2001HCAB33BPB-FREE MMC2001 View parametrics
SPC5602BAVLQ4NXP 32-bit MCU, Power Arch core, 256KB Flash, 48MHz, -40/+105degC, Automotive Grade, QFP 144 View parametrics
S912XEP100W0VAG16-bit MCU, S12X core, 1MB Flash, 50MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
MK50DN512ZCLQ10Kinetis K50: 100MHz Cortex-M4 Performance MCU, 512KB Flash, 128KB SRAM, Full-Speed USB, 144-LQFP View parametrics
S912XEP768J4MAG16-bit MCU, S12X core, 768KB Flash, 50MHz, -40/+125degC, Automotive Qualified, QFP 144 View parametrics
FS32K148UJT0VLQTS32K148 Arm Cortex-M4F, 112 MHz, 2 Mb Flash, CAN FD, FlexIO,CSEc security,ethernet,LQFP144-S32K MCUs for General Purpose View parametrics
MK40DX256VLQ10Kinetis K40: 100MHz Cortex-M4 MCU, 512KB Flash, 64KB SRAM, Full-Speed USB, Segment LCD, 144-LQFP View parametrics
SPC5743RK1MLQ5NXP 32-bit MCU, Dual Power Arch core, 2MB Flash, 200MHz, -40/+125degC, Automotive Qual,LQFP144 View parametrics
MKM35Z256VLQ7KM35: 75MHz Cortex-M0+ Metrology MCU, 256KB Flash, 64KB SRAM, Segment LCD, 144-LQFP View parametrics
MC68340CAG25E32BIT MPU,DMA,TIMER View parametrics
MC68340AG16VE32BIT MPU,DMA,TIMER View parametrics
MAC7112MAG4032-bit MCU, ARM7TDMI-S, 256KB Flash, 40MHz, -40/+125degC, Automotive Qualified, QFP 144 View parametrics
MC9S12XA256CAGS12XA 16-bit MCU, HCS12X core, 256KB Flash, 80MHz, QFP 144 View parametrics
G912XEP768J5MAG16BIT-768K FLASH-64K RAM View parametrics
MC9S12XDT256VAGS12XD 16-bit MCU, HCS12X core, 256KB Flash, 80MHz, QFP 144 View parametrics
S912XDT256F1MAG16BIT,256K FLASH,16K RAM View parametrics
S912XEP100W1VAG16-bit MCU, S12X core, 1MB Flash, 50MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
S912ZVHL64F1CLQMagniV 16-bit MCU, S12Z core, 64KB Flash, 32MHz, -40/+85degC, Automotive Qualified, QFP 144 View parametrics
SPC5517EAMLQ661.5MB Flash, z1+z0, 125C View parametrics
S912XD256F1CAG16-bit MCU, S12X core, 256KB Flash, 80MHz, -40/+85degC, Automotive Qualified, QFP 144 View parametrics
MCF52256CAG66MCF522XX 32-bit MCU, ColdFire V2 core, 256KB Flash, 66MHz, QFP 144 View parametrics
S912XEQ384BMAG16-bit MCU, S12X core, 384KB Flash, 50MHz, -40/+125degC, Automotive Qualified, QFP 144 View parametrics
S912XEP768W1VAG16-bit MCU, S12X core, 768KB Flash, 50MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
MC9S12XDT512CAGS12XD 16-bit MCU, HCS12X core, 512KB Flash, 80MHz, QFP 144 View parametrics
MK40DX128ZVLQ10Kinetis K40: 100MHz Cortex-M4 MCU, 256KB Flash, 32KB SRAM, Full-Speed USB, Segment LCD, 144-LQFP View parametrics
S912XEQ384J3MAG16-bit MCU, S12X core, 384KB Flash, 50MHz, -40/+125degC, Automotive Qualified, QFP 144 View parametrics
MC9S12XEP100MAG16-bit MCU, S12X core, 1MB Flash, 50MHz, -40/+125degC, QFP 144 View parametrics
DSPB56367AG150LEAD FREE DSP56367 View parametrics
GPC5604PF1VLQ6NXP 32-bit MCU, Power Arch core, 512KB Flash, 64MHz, -40/+105degC, Automotive Grade, QFP 144 View parametrics
S912ZVH64F2VLQMagniV 16-bit MCU, S12Z core, 64KB Flash, 32MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
SPC5603BK0CLQ6NXP 32-bit MCU, Power Arch core, 384KB Flash, -40/+85degC, Automotive Grade, QFP 144, 64MHz View parametrics
SPC5603BK0CLQ4NXP 32-bit MCU, Power Arch core, 384KB Flash, -40/+85degC, Automotive Grade, QFP 144, 48MHz View parametrics
MC9S12XHZ256VAG16-bit MCU, S12X core, 256KB Flash, 80MHz, -40/+105degC, QFP 144 View parametrics
S912ZVFP64F1VLQMagniV 16-bit MCU, S12Z core, 64KB Flash, 32MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
MK66FX1M0VLQ18Kinetis K66: 180MHz Cortex-M4F MCU, 1.2MB Flash, 256KB SRAM, 2xUSB, Ethernet, 144-LQFP View parametrics
S912XHZ512F1CAG16-bit MCU, S12X core, 512KB Flash, 80MHz, -40/+85degC, Automotive Qualified, QFP 144 View parametrics
SPC5602BK0MLQ6NXP 32-bit MCU, Power Arch core, 256KB Flash, 64MHz, -40/+85degC, Automotive Grade, QFP 144 View parametrics
S912XHZ256F1VAG16-bit MCU, S12X core, 256KB Flash, 80MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
MC68332GVAG2532BIT MCU,2KRAM,TPU,QSM View parametrics
MK51DN512ZCLQ10Kinetis K51: 100MHz Cortex-M4 Measurement MCU, 512KB Flash, 128KB SRAM, USB, Segment LCD, 144-LQFP View parametrics
MC9S12XDP512MAGS12XD 16-bit MCU, HCS12X core, 512KB Flash, 80MHz, QFP 144 View parametrics
MK30DX256VLQ10Kinetis K30: 100MHz Cortex-M4 Performance MCU, 512KB Flash, 64KB SRAM, Segment LCD, 144-LQFP View parametrics
SPC5742PK1MLQ81.5MB NVM, 2 x e200Z4 cores, 180MHz, 192K SRAM, 4 x ADC, 2 x PWM, 2 x SENT View parametrics
SPC5742PK1MLQ51.5MB NVM, 2 x e200Z4 cores, 150MHz, 192K SRAM, 4 x ADC, 2 x PWM, 2 x SENT View parametrics
S9S12H128J2VFVE16-bit MCU, S12 core, 128KB Flash, 50MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
SPC5604BK0VLQ4NXP 32-bit MCU, Power Arch core, 512KB Flash, 48MHz, -40/+105degC, Automotive Grade, QFP 144 View parametrics
S912XHZ256F1CAG16-bit MCU, S12X core, 256KB Flash, 80MHz, -40/+85degC, Automotive Qualified, QFP 144 View parametrics
SPC5604BK0VLQ6NXP 32-bit MCU, Power Arch core, 512KB Flash, 64MHz, -40/+105degC, Automotive Grade, QFP 144 View parametrics
S912XDP512J1CAG16-bit MCU, S12X core, 512KB Flash, 80MHz, -40/+85degC, Automotive Qualified, QFP 144 View parametrics
MC68HC16Z1CAG1616 BIT MCU, 1K RAM View parametrics
SPC5603BK0VLQ4NXP 32-bit MCU, Power Arch core, 384KB Flash, 48MHz, -40/+105degC, Automotive Grade, QFP 144 View parametrics
SPC5634MF2MLQ80NXP 32-bit MCU, Power Arch core, 1.5MB Flash, 80MHz, -40/+125degC, Automotive Grade, QFP 144 View parametrics
S912XET256W1VAG16-bit MCU, S12X core, 256KB Flash, 50MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
SPC5606SF1VLQ6NXP 32-bit MCU, Power Arch core, 1MB Flash, 64MHz, -40/+105degC, Automotive Grade, QFP 144 View parametrics
SPC5633MF2MLQ60NXP 32-bit MCU, Power Arch core, 1MB Flash, 60MHz, -40/+125degC, Automotive Grade, QFP 144 View parametrics
SPC5643LFF2MLQ1NXP 32-bit MCU, Dual Power Arch, 1MB Flash, 120MHz, -40/+125degC, Automotive Grade, QFP 144 View parametrics
XC56309AG100A24-BIT DSP PBFREE View parametrics
MIMXRT1021CAG4A-M7 core View parametrics
S912XHZ512F1VAG16-bit MCU, S12X core, 512KB Flash, 80MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
S912XEP768W1CAG16-bit MCU, S12X core, 768KB Flash, 50MHz, -40/+85degC, Automotive Qualified, QFP 144 View parametrics
S912XET512BVAG16-bit MCU, S12X core, 512KB Flash, 50MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
MK26FN2M0VLQ18Kinetis K26: 180MHz Cortex-M4F Performance MCU, 2MB Flash, 256KB SRAM, Dual USBs (FS + HS), 144-LQFP View parametrics
SPC5743PK1AMLQ52 x e200Z4 cores in LS, 150 MHz, 2.0MB Flash, 256kB SRAM, LQFP 144, –40°C to +125°C View parametrics
MK60DN512ZVLQ10Kinetis K60: 100MHz Cortex-M4 MCU, 512KB Flash, 128KB SRAM, Full-Speed USB, Ethernet, 144-LQFP View parametrics
MC68HC16Z1CAG2016 BIT MCU, 1K RAM View parametrics
SPC5602BK0CLQ4NXP 32-bit MCU, Power Arch core, 256KB Flash, 48MHz, -40/+85degC, Automotive Grade, QFP 144 View parametrics
MC68HC16Z1CAG2516 BIT MCU, 1K RAM View parametrics
S912XEG384J2VAG16-bit MCU, S12X core, 384KB Flash, 50MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
S912XEQ512BMAG16-bit MCU, S12X core, 512KB Flash, 50MHz, -40/+125degC , Automotive Qualified, QFP 144 View parametrics
FS32K148UGT0VLQTS32K148 ArmCortex-M4F,112 MHz,2Mb Flash,ISELED,CAN FD,FlexIO,CSEc security,ethernet,LQFP144-S32K MCUs General Purpose View parametrics
MC9S12XEQ512CAG16-bit MCU, S12X core, 512KB Flash, 50MHz, -40/+85degC, QFP 144 View parametrics
MK20DN512ZVLQ10Kinetis K20: 100MHz Cortex-M4 Performance MCU, 512KB Flash, 128KB SRAM, Full-Speed USB, 144-LQFP View parametrics
MK24FN1M0VLQ12Kinetis K24: 120MHz Cortex-M4F Performance MCU, 1MB Flash, 256KB SRAM, Full-Speed USB, 144-LQFP View parametrics
SPC5516EAVLQ66NXP 32-bit MCU, Power Arch core, 1MB Flash, 66MHz, -40/+105degC, Automotive Grade, QFP 144 View parametrics
SPC5744PFK1AKLQ82 x e200Z4 cores in LS, 180 MHz, 2.5MB Flash, 384kB SRAM, LQFP 144, 1 x FlexRay, –40°C to +135°C View parametrics
S912XEP100BCAG16-bit MCU, S12X core, 1MB Flash, 50MHz, -40/+85degC, Automotive Qualified, QFP 144 View parametrics
MC9S12XD256CAGS12XD 16-bit MCU, HCS12X core, 256KB Flash, 80MHz, QFP 144 View parametrics
MKV58F512VLQ24Kinetis KV58: 220MHz Cortex-M7F Real-Time Control MCU, 512KB Flash, 128KB SRAM, Ethernet, 144-LQFP View parametrics
GAC7116J0VAG5032-bit MCU, ARM7 core, 1MB Flash, 50MHz, -40/+105degC, Automotive Qualified, QFP 144 View parametrics
MIMXRT1021DAG5A-M7 core View parametrics
S912ZVH64F2CLQMagniV 16-bit MCU, S12Z core, 64KB Flash, 32MHz, -40/+85degC, Automotive Qualified, QFP 144 View parametrics
SPC5607BAVLQ6NXP 32-bit MCU, Power Arch core, 1.5MB Flash, 64MHz, -40/+105degC, Automotive Grade, QFP 144 View parametrics
S912ZVFP32F1CLQMagniV 16-bit MCU, S12Z core, 32KB Flash, 32MHz, -40/+85degC, Automotive Qualified, QFP 144
Sours: https://www.nxp.com/packages/SOT486-2
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LQFP-144 footprint

Abstract: LQFP 144 footprint LQFP PACKAGE footprint cluster stepper motor 80 LQFP footprint S12XE S12X S12C QFP-112 instrument cluster
Text: Controller, 6 ch motor control modules with Stepper Stall Detect Small Footprint Small Footprint 2-8 2-3 1-2 1 8 Ch 16 bit 80 QFP, 112 LQFP, 144 LQFP, 208 MAPGA FlexRay S12XF Instrument , 16 Ch 10 bit Up to 6 Ch 0KB-4KB 7-16 10 bit 112 LQFP, 144 LQFP 4-8 Ch 8 bit 80 QFP, 112


Original PDF 50MHz 128KB-1MB 12KB-64KB 40MHz 64KB-256KB 4KB-12KB 32KB-128KB 8-16MHz S12XE LQFP-144 footprintLQFP 144 footprintLQFP PACKAGE footprintcluster stepper motor80 LQFP footprintS12XES12XS12CQFP-112instrument cluster
2012 - Not Available

Abstract: No abstract text available
Text: integration allows you to design an instrument cluster with a smaller and more energy-efficient footprint , system reliability. The S12ZVH family will be available with two package options: 100 LQFP and 144 LQFP , -ch. I2C ADC 10-bit, 8-ch. Segment LCD (Up to 4x40) S12Z CPU 144 -pin LQFP 100-pin LQFP GPIO , Channels S12ZVH128CLQ LQFP 144 20*20*1.4P0.5 128 KB 8 KB 4 KB 4 — 40 x 4 1 , — — 4 S12ZVH64CLQ LQFP 144 20*20*1.4P0.5 64 KB 4 KB 4 KB 4 — 40


Original PDF S12ZVHLL18UHVS12ZVHL32CLL S12ZVFP64CLQ S12ZVFP64CLL com/S12ZVH.S12ZVHFS
2012 - instrument cluster

Abstract: No abstract text available
Text: allows you to design an instrument cluster with a smaller and more energy-efficient footprint , system reliability. The S12ZVH family will be available with two package options: 100 LQFP and 144 LQFP , -ch. I2C ADC 10-bit, 8-ch. Segment LCD (Up to 4x40) S12Z CPU 144 -pin LQFP 100-pin LQFP GPIO , ADC Channels S12ZVH128CLQ LQFP 144 20*20*1.4P0.5 128 KB 8 KB 4 KB 4 – 40 x , €“ 32 x 4 – – 4 S12ZVH64CLQ LQFP 144 20*20*1.4P0.5 64 KB 4 KB 4 KB 4 â


Original PDF S12ZVHLL18UHVS12ZVHY32CLL S12ZVFP64CLQ S12ZVFP64CLL com/S12ZVH.S12ZVHFSinstrument cluster
2008 - MCF52259CAG80

Abstract: MCF52254AF80 MCF52255CAF80 MCF5225x MCF52258CVN66 M52259EVB MCF52256CVN66 LQFP 144 footprint MCF52252 MCF52256
Text: 32 No 0°C to +70°C 144 LQFP MCF52258AG80 80 No 512 64 No 0°C to +70°C 144 LQFP MCF52256CAG66 66 Yes 256 64 No -40°C to +85°C 144 LQFP MCF52259CAG80 80 Yes 512 64 Yes -40°C to +85°C 144 LQFP MCF52258CAG66 66 Yes 512 64 No -40°C to +85°C 144 LQFP MCF52258VN80 80 No 512 64 No 0°C to +70°C 144 MAPBGA MCF52256VN80 80 No 256 32 No 0°C to +70°C 144 MAPBGA


Original PDF MCF5225xMCF5225x 32-bitKRN3MCF5225XFSMCF52259CAG80MCF52254AF80MCF52255CAF80MCF52258CVN66M52259EVBMCF52256CVN66LQFP 144 footprintMCF52252MCF52256
2005 - LQFP-176 footprint

Abstract: LQFP-144 footprint "microsecond bus" MPC563XMFS LQFP 144 footprint MPC5634 microsecond bus IEEE-ISTO MPC5632M MPC563xM
Text: · Offers a 144 -pin quad flat package the CPU of total SRAM and up to 80 MHz of (QFP) option , (VLE) capability Nexus IEEE-ISTO 5001-2003 MMU to help reduce code footprint by up to 30 , -bit 144 LQFP, 176 LQFP, 208 MAPBGA MPC5633M 40 MHz, 60 MHz, 80 MHz 64K 1x 32-ch. 1x 16-ch.34-ch. dual 12-bit 100 LQFP, 144 LQFP, 176 LQFP, 208 MAPBGA Product MPC5632M , , 144 LQFP · 32-channel enhanced DMA controller · 191 source interrupt controller · Nexus IEEE-ISTO


Original PDF 32-bitMPC563xM32-bit,16-bitMPC563XMFS LQFP-176 footprintLQFP-144 footprint"microsecond bus"MPC563XMFSLQFP 144 footprintMPC5634microsecond busIEEE-ISTOMPC5632M
2008 - LQFP-64 footprint

Abstract: e200z0h stepper motor color code LQFP-176 footprint MPC5604S MPC5602S nexus 5001 MPC560xS MPC5606s LQFP 144 footprint
Text: EVB motherboard and daughter card (including 144 -pin MPC5606S MCU) $360 XPC560XS208EM144MPC560xS 208- to 144 -pin adapter. Enables 208-pinMPC560xS to adapt to 144 -pin footprint . 208 , 144 LQFP, 176 LQFP 64 MHz MPC5604S CVM e200z0h core, up to 64 MHz, 512 KB flash, 4 x 16 KB EEPROM emulation block (ECC), 48 KB RAM, 12 entry MPU, 16-ch. eDMA 144 LQFP 64 MHz , KB RAM, 12 entry MPU, 16-ch. eDMA 144 LQFP 64 MHz Low Power Design · Designed for dynamic


Original PDF 32-bitMPC560xSMPC560XSFAMFS MPX560xSLQFP-64 footprinte200z0hstepper motor color codeLQFP-176 footprintMPC5604SMPC5602Snexus 5001MPC5606sLQFP 144 footprint
2005 - 56800E

Abstract: 56F8300 56F8345 56F8346 56F8347 DSP56800E DSP56800ERM MC56F8300UM MC56F8347
Text: 56F8346, the 56F8347 is the device for you. With its 144 KB of on-chip Flash memory, the 56F8347 has the same memory footprint as the 56F8346, yet provides an additional 14 digital I/O pins with its 160 , control functionality with a smaller memory footprint than competing architectures > High-performance , high-speed volatile and nonvolatile components: · 144 KB total Flash memory > 128 KB of Program Flash > 8


Original PDF 56F8347 56800E36-bit56F8347FS MC56F8347MPY60 56F830056F834556F834656F8347DSP56800EDSP56800ERMMC56F8300UMMC56F8347
2005 - 56F8346

Abstract: 56F8345 MC56F8300UM 56800E 56F8300 DSP56800E DSP56800ERM MC56F8346
Text: device for you. Moving to this 144 -pin LQFP package allows you to take advantage of its external memory interface for these additional tasks. You will still enjoy 144 KB of on-chip Flash memory, pulse-width , Power Management (2) SPI (2) SCI JTAG/EOnCE 56800E Core 60 MIPS 60 MHz 144 LQFP (16) 16 , control functionality with a smaller memory footprint than competing architectures > High-performance , fault inputs > On-chip memory includes high-speed volatile and nonvolatile components: · 144 KB


Original PDF 56F8346 56800E56F834556F8346FS MC56F8346MFV60 56F8346MC56F8300UM56F8300DSP56800EDSP56800ERMMC56F8346
2001 - JESD51-8

Abstract: JESD51-2 JEDEC JESD51-8 surface mount package dimensions qfn 44 PACKAGE footprint 9mm FREESCALE PACKING jesd51 8 JEDEC-STD-020 JEDEC-STD020 tqfp 44 PACKAGE footprint
Text: . With the correct pad footprint geometry, the packages will self align to the PCB board when subjected , . With the correct pad footprint geometry, the packages will self align to the PCB board when subjected , to all surface mount (SMT) processes. With the correct pad footprint geometry, the packages will , Products, Motorola offers both package styles in lead counts ranging from 44 to 144 to cover a large , 16.00 0.60 0.30 0.15 144 LQFP 20.00 20.00 0.50 0.10 1.40 22.00 22.00


Original PDF BR1568/D JESD51-8JESD51-2JEDEC JESD51-8surface mount package dimensionsqfn 44 PACKAGE footprint 9mmFREESCALE PACKINGjesd51 8JEDEC-STD-020JEDEC-STD020tqfp 44 PACKAGE footprint
2005 - MC56F8356

Abstract: DSP56800E 56F8356 56F8355 56F8346 56F8300 56800E MC56F8300UM DSP56800ERM programmable digital pwm I2C multiphase
Text: with the additional memory of external devices without sacrificing performance Moving to this 144 , (2) SCI JTAG/EOnCE 56800E Core 60 MIPS 60 MHz 144 LQFP Data Memory FlexCAN Power , functionality with a smaller memory footprint than competing architectures > PWM and analog-to-digital , Part 144 -40°C to +105°C MC56F8356VFV60MC56F8356 Package Type Low-Profile Quad Flat Pack , Document Number: 56F8356FS REV 1 144 -40°C to +125°C MC56F8356MFV60 Freescale Semiconductor


Original PDF 56F8356 56800E56F8356FS MC56F8356MFV60 MC56F8356DSP56800E56F835656F835556F834656F8300MC56F8300UMDSP56800ERMprogrammable digital pwm I2C multiphase
2005 - 56800E

Abstract: 56F8300 56F8365 56F8366 DSP56800E DSP56800ERM MC56F8300UM MC56F8366 MC56F8366VFV60
Text: . Moving to this 144 -pin LQFP package allows you to take advantage of its included external memory , -bit single-cycle data fetches > Proven to deliver more control functionality with a smaller memory footprint , 62 GPIO (2) SCI JTAG/EOnCE 56800E Core 60 MIPS 60 MHz 144 LQFP (16) 16-bit Timer 16 , Pack (LQFP) Pin Count 144 Temperature Range Award-Winning Development Environment , Pack (LQFP) Pin Count Temperature Range Order Number -40°C to +125°C 144 -40°C to +105°C


Original PDF 56F8366 56800E36-bitMC56F8366FS MC56F83663MFV60 MC56F8366 MC56F8366VFV60 56F830056F836556F8366DSP56800EDSP56800ERMMC56F8300UMMC56F8366MC56F8366VFV60
2008 - PCI express PCB footprint

Abstract: TSI382 PCI FOOTPRINT lqfp-176 pcb LAYOUT LQFP-176 PCI footprint 176 lqfp msi computers pci non-transparent bridge Motherboards laptop layout
Text: The Tsi382 BGA package has the smallest footprint of any PCIe-to-PCI bridge on the market, while the , Smallest Footprint The Tsi382 BGA package has the smallest footprint of any PCIe-to-PCI device on the , constraints · Packaging: ­ BGA: 144 -pin, 10x10 mm, 0.8 mm ball pitch, Industrial operating temperature, with , that need to bridge PCIe to downstream PCI devices. Its flexibility, high performance, small footprint , DVR Card Application Camera Camera Camera Camera · Minimizes board space due to small footprint


Original PDF Tsi382TM Tsi38280E2010Tsi382 PCI express PCB footprintPCI FOOTPRINTlqfp-176 pcb LAYOUTLQFP-176 PCIfootprint 176 lqfpmsi computerspci non-transparent bridgeMotherboards laptop layout
Blood Glucose Meter

Abstract: UPD78F1166 upd78f1167 uPD78F1155 uPD78F1165 UPD78F1146 uPD78F1176 UPD78F1144 uPD78F1142 Self Programming 78k0r
Text: comprehensive set of debug functions encased in a small footprint enclosure, enabling the development of most , of 50 devices in 64- to 144 -pin packages, and 64 KB to 512 KB of SST SuperFlash® Flash memory , * UPD78F1178 128 512KB 30KB UPD78F1184 144 128KB 8KB UPD78F1185 144 192KB 10KB KJ3* UPD78F1186 144 256KB 12KB KJ3* Operating Current Consumption (3 V) RAM , of Flash memory. Devices are available in 64- to 144 - pin packages. All devices contain the similar


Original PDF 78K0R16-bit78K0R.com/78k0r Blood Glucose MeterUPD78F1166upd78f1167uPD78F1155uPD78F1165UPD78F1146uPD78F1176UPD78F1144uPD78F1142Self Programming 78k0r
2003 - Package FPT-144P-M08

Abstract: Socket IC 80 pin LQFP SS01-71031-2E FPT-144P-M08 PGA-401P LQFP 144 footprint mb91240
Text: dimensions 4 MCU footprint design notes Figure 2 shows the recommended dimensions of the NQPACK footprint mounted on the PC board of the user system. The PC board of the user system must be designed with due consideration given to this footprint as well as to the mass production MCU. For more information , dimensions of the footprint for mounting the NQPACK 5 4. Procedure for Connecting the User System , screws in sequence. Tightening the screws too tight might result in a defective contact. 144 SD


Original PDF SS01-71031-2E LQFP-144PMB2198-123 MB2198-123)MB2198-01)MB91240Package FPT-144P-M08Socket IC 80 pin LQFPSS01-71031-2EFPT-144P-M08PGA-401PLQFP 144 footprint
2003 - LQFP 144 footprint

Abstract: No abstract text available
Text: Header board dimensions 4 MCU footprint design notes Figure 2 shows the recommended dimensions of the NQPACK footprint mounted on the PC board of the user system. The PC board of the user system must be designed with due consideration given to this footprint as well as to the mass production MCU , Figure 2 Recommended dimensions of the footprint for mounting the NQPACK 5 4. Procedure for , might result in a defective contact. 144 SD TET NQPACK INDEX( ) The corner is cut lineally


Original PDF LQFP-144PMB2198-123)MB2198-01)MB91240FPT-144P-M08)SS01-71031-1E LQFP 144 footprint
2004 - 52855

Abstract: ZHX1000 ZHX3403 ZHX2010 ZHX1820 ZHX1810 ZHX1403 ZHX1203 ZHX1201 ZHX1010
Text: FP ~ 307sq mm FP: 194.6 sq mm FP~ 144 sq mm FP ~ 165 sq mm FP~ 49 sq mm FP - FOOTPRINT , ² FP: 428mm² FP: 256mm² FP: 121mm² FP - FOOTPRINT Figure 52. 100/ 144 -Lead Migration , Package . . . . . . . . . . . . . . 25 144 -Lead Plastic Low-Profile Quad Flat Package . . . . . . . . . . , . . . . . . . . . . . . . . . . . 30 144 -Lead Plastic Quad Flat Package . . . . . . . . . . . . . . , 144 -Lead Low-Profile Ball Grid Array . . . . . . . . . . . . . . . . . . . . . . . ZHX1000


Original PDF PS007217-0804 52855ZHX1000ZHX3403ZHX2010ZHX1820ZHX1810ZHX1403ZHX1203ZHX1201ZHX1010
Not Available

Abstract: No abstract text available
Text: €¢ Minimizes board space due to small footprint 32/64-bit addressing and 32-bit data Operates up to 66 MHz , supply, 3.3V I/O • No power sequencing constraints • Packaging: – BGA: 144 -pin, 10 x 10 mm, 0.8 , Board Product Brief Smallest Footprint The Tsi382 BGA package has the smallest footprint of any , flexibility, high performance, small footprint , and low power consumption, make it ideal for a wide range of


Original PDF Tsi382â2004August80E2010
2007 - ZHX1203

Abstract: za9l 52855 ZHX2022 ZHX1820 ZHX1810 ZHX1423 ZHX1403 ZHX1223 MC 1200 Motor Control Board
Text: : 169mm² FP: 428mm² FP: 256mm² FP: 121mm² FP - FOOTPRINT Figure 58. 100/ 144 -Lead Migration , Package . . . . . . . . . . . . . . 23 144 -Lead Plastic Low-Profile Quad Flat Package . . . . . . . . . . , Package . . . . . . . . . . . . . . . . . . . . . . . . 144 -Lead Plastic Quad Flat Package . . . . . . . , . . . . 144 -Lead Low-Profile Ball Grid Array . . . . . . . . . . . . . . . . . . . . . . . . 196 , / 144 -Lead Migration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 28 29


Original PDF PS007225-0607 componeMKT71C1191-00 MKT71C1187-00 MKT71C1153-00 MKT71C1188-00 MKT71C1190-00 MKT71C1189-00 MKT71C0002-00 MKT71C1172-00 ZHX1203za9l52855ZHX2022ZHX1820ZHX1810ZHX1423ZHX1403ZHX1223MC 1200 Motor Control Board
Not Available

Abstract: No abstract text available
Text: €¢ BGA Pa ck a ge • Minimizes board space due to small footprint 32/64-bit addressing and 32 , : – BGA: 144 -pin, 10 x 10 mm, 0.8 mm ball pitch, Industrial operating temperature, with RoHS/Green , footprint of any PCIe-toPCI device on the market. The device is offered in a 10 x 10 mm package with a , PCIe to downstream PCI devices. Its flexibility, high performance, small footprint , and low power


Original PDF 2004August80E2010
2007 - mpc5517

Abstract: MPC5516E MPC5510 MPC5516 mpc5517s MPC5515 MPC5517E EMIOS200 mpc5517 datasheet mpc5517 E
Text: MPC5515SMPC5514GMPC5514E 144 -LQFP 144 -LQFP e200z1 Maximum 80 MHz at Ta=105C 80 MHz at Ta=105C Execution Speed2 75 MHz at Ta=125C 75 MHz at Ta=125C 3 MPC5516E 144 -LQFP 208-BGA/ 144 -LQFP 208-BGA/ 144 -LQFP 208-BGA 144 -LQFP 208-BGA/ 144 -LQFP 176-LQFP 144 -LQFP 176-LQFP176-LQFP 176 , Yes10 Yes9 Yes10 Yes9 Yes10 Yes9 GPIO11 144 111 144 /137 111 144 /137 111 144 /137 111 144 /137 - 111 - 137 111 137 NOTES: 1 Maximum feature


Original PDF MPC5510PB MPC551032-Bitmpc5517MPC5516EMPC5516mpc5517sMPC5515MPC5517EEMIOS200mpc5517 datasheetmpc5517 E
2004 - 56800E

Abstract: MC56F8346 MC56F8300UM DSP56800ERM DSP56800E 56F8346 56F8300 56F8146 56F8145 fault find reset ups circuit diagram
Text: , then the 56F8146 is the device for you. Moving to this 144 -pin LQFP package allows you to take , JTAG/EOnCE Up to 62 GPIOs 56800E Core (8) 16-bit Timers 40 MIPS 40 MHz 144 LQFP 16 , control functionality with a smaller memory footprint than competing architectures > High-performance , MC56F8146 144 LQFP MC56F8146VPY -40° to +105°C Freescale Semiconductor


Original PDF 56F8146 16-bit56800E36-bitMC56F8146FS MC56F8146 MC56F8146VPY MC56F8346MC56F8300UMDSP56800ERMDSP56800E56F834656F830056F814656F8145fault find reset ups circuit diagram
2004 - MC56F

Abstract: 56F8366 56800E 56F8300 56F8365 MC56F8300UM MC56F8366
Text: parallel fashion, then the 56F8366 is the device for you. Moving to this 144 -pin LQFP package allows you to , with a smaller memory footprint than competing architectures COP/ Watchdog Program Memory , (2) SCI RAM 4KB 56800E Core 60 MIPS 60MHz 144 LQFP (2) Quadrature Decoder Data Memory , Interrupt module ORDERING INFORMATION PART MC56F8366 PACKAGE 144 LQFP ORDER NUMBER


Original PDF 56F836656F8365144-pin576KBMC56F8366 MC56F8366MFV60 MC56F8366VFV60 MC56F8366PB MC56F56800E56F8300MC56F8300UMMC56F8366
2004 - 56800E

Abstract: 56F8300 56F8346 56F8355 56F8356 MC56F8300UM MC56F8356 serial peripheral interface timing diagram 60MHz
Text: for a migration strategy? Moving to this 144 -pin LQFP package allows you to take advantage of the , with a smaller memory footprint than competing architectures COP/ Watchdog Program Memory , 56800E Core 60 MIPS 60MHz 144 LQFP (2) Quadrature Decoders Data Memory EXAMPLE APPLICATIONS · , MC56F8356 PACKAGE 144 LQFP ORDER NUMBER MC56F8356VFV60 TEMPERATURE RANGE -40° to 105


Original PDF 56F835656F8355,56F8346,56F8346 144-pinMC56F8356PB DSP56800E 56800E56F830056F834656F8355MC56F8300UMMC56F8356serial peripheral interface timing diagram 60MHz
2004 - fault find ups circuit diagram

Abstract: 56800E 56F8145 56F8146 56F8300 DSP56800E MC56F8300UM MC56F8346
Text: parallel fashion, then the 56F8146 is the device for you. Moving to this 144 -pin LQFP package allows you to , with a smaller memory footprint than competing architectures EXAMPLE APPLICATIONS · · · · · · , 56800E Core 40 MIPS 40MHz 144 LQFP Quadrature Decoder JTAG/ EOnCE 16 Channels 12-bit ADC , Peripherals Manual 144 LQFP ORDER NUMBER PRODUCT DOCUMENTATION -40° to 105°C FreescaleTM and


Original PDF 56F8146144-pin136KBflexibili6F8146 MC56F8146PB DSP56800E DSP56800E16-bit fault find ups circuit diagram56800E56F814556F8300MC56F8300UMMC56F8346
2005 - 56800E

Abstract: 56F8145 56F8146 56F8300 56F8346 DSP56800E DSP56800ERM MC56F8300UM MC56F8346
Text: device for you. Moving to this 144 -pin LQFP package allows you to take advantage of its included , Flash (2) SCI JTAG/EOnCE Up to 62 GPIO 56800E Core (8) 16-bit Timer 40 MIPS 40 MHz 144 , ) > Proven to deliver more control functionality with a smaller memory footprint than competing , Quad Flat Pack (LQFP) Pin Count 144 Temperature Range Award-Winning Development Environment


Original PDF 56F8146 56800EMC56F8146FS MC56F8146VPY 56F814556F814656F830056F8346DSP56800EDSP56800ERMMC56F8300UMMC56F8346
Sours: https://www.datasheetarchive.com/LQFP-144%20footprint-datasheet.html
STM32F767BIT6 144 pin LQFP microController and PCB Inspection

SOT486-1: LQFP144

LPC2290FBD14416/32-bit ARM microcontroller with CAN, 10-bit ADC and external memory interface View parametrics LPC2214FBD144Single-chip 16/32-bit ARM microcontrollers; 128/256 kB ISP/IAP flash with 10-bit ADC and external memory interface View parametrics LPC1812JBD144High Performance 32-bit Microcontroller based on ARM Cortex-M3 View parametrics LPC4330FBD144Dual-core Cortex-M4/M0, 264 kB SRAM, 2 HS USB with on-chip PHY, Ethernet, CAN, AES, SPIFI, SGPIO, SCT View parametrics LPC4320FBD144High Performance 32-bit Microcontroller (MCU) based on ARM Cortex-M4/M0 Cores View parametrics LPC4310FBD144High Performance 32-bit Microcontroller (MCU) based on ARM Cortex-M4/M0 Cores View parametrics LPC1822JBD144High Performance 32-bit Microcontroller based on ARM Cortex-M3 View parametrics LPC4337FBD144High Performance 32-bit Microcontroller (MCU) based on ARM Cortex-M4/M0 Cores View parametrics LPC4325JBD14432-bit ARM Cortex-M4/M0 MCU; up to 1 MB flash and 136 kB SRAM; two High-speed USB, LCD, EMC View parametrics LPC4315JBD14432-bit ARM Cortex-M4/M0 MCU; up to 1 MB flash and 136 kB SRAM; Ethernet, two High-speed USB, LCD, EMC View parametrics LPC18S37JBD14432-bit ARM Cortex-M3 MCU; 1 MB flash and 136 kB SRAM; Ethernet, two High-speed USB, EMC, AES engine View parametrics LPC1823JBD144High Performance 32-bit Microcontroller based on ARM Cortex-M3 View parametrics LPC4327JBD14432-bit ARM Cortex-M4/M0 MCU; up to 1 MB flash and 136 kB SRAM; two High-speed USB, LCD, EMC View parametrics LPC4076FBD144Mid-range 32-bit Microcontroller (MCU) based on ARM Cortex-M4 Core View parametrics LPC1810FBD144High Performance 32-bit Microcontroller based on ARM Cortex-M3 View parametrics LPC1830FBD144High Performance 32-bit Microcontroller based on ARM Cortex-M3 View parametrics LPC4312JBD144High Performance 32-bit Microcontroller (MCU) based on ARM Cortex-M4/M0 Cores View parametrics LPC2220FBD14416/32-bit ARM microcontrollers; flashless, with 10-bit ADC and external memory interface View parametrics LPC4088FBD144Mid-range 32-bit Microcontroller (MCU) based on ARM Cortex-M4 Core View parametrics LPC43S37JBD14432-bit ARM Cortex-M4/M0 MCU; 1 MB flash and 136 kB SRAM; Ethernet, 2 x USB, EMC, AES engine View parametrics LPC1815JBD144High Performance 32-bit Microcontroller based on ARM Cortex-M3 View parametrics LPC2388FBD144ARM7 with 512 kB flash, 98 kB SRAM, Ethernet, USB 2.0 Device/Host/OTG, CAN, and 10-bit ADC View parametrics LPC2919FBD144ARM9 microcontroller with CAN and LIN View parametrics LPC2294HBD14416/32-bit ARM microcontrollers; 256 kB ISP/IAP flash with CAN, 10-bit ADC and external memory interface View parametrics LPC2377FBD144ARM7 with 512KB flash, 58 KB SRAM, Ethernet, and 10-bit ADC View parametrics LPC2292FBD14416/32-bit ARM microcontrollers; 256 kB ISP/IAP flash with CAN, 10-bit ADC and external memory interface View parametrics LPC1837JBD144High Performance 32-bit Microcontroller based on ARM Cortex-M3 View parametrics LPC2212FBD144Single-chip 16/32-bit ARM microcontrollers; 128/256 kB ISP/IAP flash with 10-bit ADC and external memory interface View parametrics LPC1774FBD144Scalable Mainstream 32-bit Microcontroller (MCU) based on ARM Cortex-M3 Core View parametrics LPC2917FBD144ARM9 microcontroller with CAN and LIN View parametrics LPC2927FBD144ARM9 microcontroller with CAN, LIN, and USB View parametrics LPC4333JBD144High Performance 32-bit Microcontroller (MCU) based on ARM Cortex-M4/M0 Cores View parametrics LPC43S30FBD14432-bit ARM Cortex-M4/M0 flashless MCU with security features; 264 kB SRAM; Ethernet; two HS USBs View parametrics LPC1817JBD144High Performance 32-bit Microcontroller based on ARM Cortex-M3 View parametrics LPC4313JBD144High Performance 32-bit Microcontroller (MCU) based on ARM Cortex-M4/M0 Cores View parametrics LPC43S20FBD14432-bit ARM Cortex-M4/M0 flashless MCU with security features; 200 kB SRAM; USB View parametrics LPC1788FBD144Scalable Mainstream 32-bit Microcontroller (MCU) based on ARM Cortex-M3 Core View parametrics LPC1827JBD144High Performance 32-bit Microcontroller based on ARM Cortex-M3 View parametrics LPC1778FBD144Scalable Mainstream 32-bit Microcontroller (MCU) based on ARM Cortex-M3 Core View parametrics LPC4323JBD144High Performance 32-bit Microcontroller (MCU) based on ARM Cortex-M4/M0 Cores View parametrics LPC4074FBD144Mid-range 32-bit Microcontroller (MCU) based on ARM Cortex-M4 Core View parametrics LPC4317JBD14432-bit ARM Cortex-M4/M0 MCU; up to 1 MB flash and 136 kB SRAM; Ethernet, two High-speed USB, LCD, EMC View parametrics LPC1833JBD144High Performance 32-bit Microcontroller based on ARM Cortex-M3 View parametrics LPC1813JBD144High Performance 32-bit Microcontroller based on ARM Cortex-M3 View parametrics LPC2926FBD144ARM9 microcontroller with CAN, LIN, and USB View parametrics LPC4337JBD14432-bit ARM Cortex-M4/M0 MCU; up to 1 MB flash and 136 kB SRAM; Ethernet, two High-speed USB, LCD, EMC View parametrics LPC1820FBD144High Performance 32-bit Microcontroller based on ARM Cortex-M3 View parametrics LPC4322JBD14432-bit ARM Cortex-M4/M0 MCU; up to 1 MB flash and 136 kB SRAM; two High-speed USB, LCD, EMC View parametrics LPC4078FBD14432-bit ARM Cortex-M4 MCU; up to 512 kB flash, 96 kB SRAM; USB Device/Host/OTG; Ethernet; EMC; SPIFI View parametrics LPC2210FBD14416/32-bit ARM microcontrollers; flashless, with 10-bit ADC and external memory interface View parametrics LPC1825JBD144High Performance 32-bit Microcontroller based on ARM Cortex-M3 View parametrics LPC18S30FBD14432-bit ARM Cortex-M3 flashless MCU with security features; 200 kB SRAM; Ethernet, two HS USB, EMC View parametrics LPC2929FBD144ARM9 microcontroller with CAN, LIN, and USB View parametrics LPC2378FBD144ARM7 with 512KB flash, 58 KB SRAM, Ethernet, USB 2.0 Device, CAN, and 10-bit ADC View parametrics LPC18S10FBD14432-bit ARM Cortex-M3 flashless MCU with security features; 136 kB SRAM; EMC View parametrics
Sours: https://www.nxp.com/packages/SOT486-1

144 lqfp

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STM32H743 LQFP144 MINI 보드

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